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Semiconductors

TSMC breaks ground on first Europe chip fab with eye on auto sector

Chipmaker scrambles for staff in Dresden to avoid delays in overseas expansion

Taiwan Semiconductor Manufacturing Co. aims to start up the fabrication facility in Dresden by 2027.   © Reuters

TAIPEI -- Taiwan Semiconductor Manufacturing Co. on Tuesday broke ground on its first fabrication facility in Europe to provide a steady supply of automotive chips for one of the region's core industries.

The ceremony for the plant in Dresden, Germany, was attended by TSMC Chairman and CEO C.C. Wei, European Commission President Ursula von der Leyen and German Chancellor Olaf Scholz.

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